JPH03101545U - - Google Patents
Info
- Publication number
- JPH03101545U JPH03101545U JP1027890U JP1027890U JPH03101545U JP H03101545 U JPH03101545 U JP H03101545U JP 1027890 U JP1027890 U JP 1027890U JP 1027890 U JP1027890 U JP 1027890U JP H03101545 U JPH03101545 U JP H03101545U
- Authority
- JP
- Japan
- Prior art keywords
- external terminal
- internal lead
- semiconductor chip
- semiconductor device
- gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1027890U JPH03101545U (en]) | 1990-02-05 | 1990-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1027890U JPH03101545U (en]) | 1990-02-05 | 1990-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101545U true JPH03101545U (en]) | 1991-10-23 |
Family
ID=31513855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1027890U Pending JPH03101545U (en]) | 1990-02-05 | 1990-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101545U (en]) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| JPS6076153A (ja) * | 1983-10-03 | 1985-04-30 | Fuji Electric Co Ltd | 樹脂封止半導体装置 |
| JPS63104454A (ja) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | 半導体装置 |
| JPH01296649A (ja) * | 1988-05-24 | 1989-11-30 | Mitsubishi Electric Corp | 半導体装置 |
-
1990
- 1990-02-05 JP JP1027890U patent/JPH03101545U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| JPS6076153A (ja) * | 1983-10-03 | 1985-04-30 | Fuji Electric Co Ltd | 樹脂封止半導体装置 |
| JPS63104454A (ja) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | 半導体装置 |
| JPH01296649A (ja) * | 1988-05-24 | 1989-11-30 | Mitsubishi Electric Corp | 半導体装置 |